Technology of Yasojima Proceed focuses on precision machiningHigh precision processing Technology

Precision processing Technology

Confirmation procedure in machining process

  • Requirements are confirmed
  • Machining shapes are confirmed
  • Material characteristics are confirmed
  • Machining process and condition are selected
  • Manufacturing procedures are confirmed
  • Accuracies are verified

    * Annealing conditions for each material are selected
    3D Modeling, CAM
    Machining procedures are confirmed after assembly

Various types of machining

  • Three dimensional machining
  • Integrating machining
  • No warp / twist / burr machining
  • Postprocessing after welding & assembly
  • High precision plate & rod machining

High precision machining

We process to achieve accuracy required by customer by combining optimum process and machining condition according to the characteristics of material and shape of parts.


Application

Semiconductor production equipment, semiconductor inspection equipment, LCD production equipment, conveyor, parts for aerospace industry's, test equipment etc.


Photos

Micro Precision machining

Appropriate environment and facilities are established for machining dimensional tolerance and geometrical tolerance in μ unit, as well as an inspection system in which micro precision machined products are verified.


Applications

Bio-related (μTAS), semiconductor inspection equipment, analysis equipment, precision equipment, medical equipment and others.


Photos

Free form surface machining.

High accuracy 5-axis simultaneous control machining is employed to machine shapes with free form.


Applications

Medical equipment, aerospace industry, analysis equipment, precision equipment etc.


Photos

Lapping & Polishing

Parallelism and flatness are lapped and surfaces are polished.

Lapping Flatness / Parallelism 5μm  Max diameter Φ400mm
Polishing Surface accuracy Ra 0.01μm  Max diameter Φ400mm


Application

Semiconductor manufacturing equipment, semiconductor inspection equipment, LCD manufacturing equipment, conveyor, aerospace industry, test equipment etc.


Photos

Micro hole drilling

Micro hole drilling of which process can be affected by fractional vibrations, is performed under the environment where anti-vibration, temperature & humidity control are fully established.

Precision machining, micromachining and roughness control processing are carried out at Sendai Factory designed optimally and constructed with anti-vibration structure.

Anti-Vibration Floor Structure
The factory was designed and constructed, based on the academic advices and guidance provided by School of engineering, Tohoku University.
The floor with the anti-vibration structure protect the building from vibrations caused externally and also avoids transferring them to other areas.

Temperature & Humidity Control System
The temperature & Humidity Control System was designed and constructed, based on the academic advices and guidance provided by the Mechanical System Engineering Section of the engineering department, Shiga Prefectural University.
With enhanced heat insulation effect, an air-conditioning system which utilizes cool and warm water, is installed, while multiple numbers of sensors installed in each area enables the temperature to be kept at 21℃±1℃ and humidity at 50%±10% .


Applications

Semiconductor manufacturing equipment, semiconductor inspection equipment, chemical equipment and others.


Photos

*1: MELDIN7021 (Polyimide), Hole diameter: 0.15mm, Counterbore diameter: 0.35mm, Pitch: 0.5mm
*2: Sumika Super S1000, Hole diameter: 0.08mm, Pitch: 0.3mm


Examples of machining (Sumika Super S1000)

Min hole diameter
330μm (0.03mm) * Plate thickness 0.5mm
Min inter-hole wall thickness
10μm (0.01mm) * Hole diameter 0.07mm, * Hole pitch 0.08mm

Burr Removal

Burrs, which are generated during machining, require to be removed from all products. Yasojima, with 80-year rich experiences in resin manufacturing, has developed technologies which minimizes the occurrence of burrs and removes burrs cleanly.


Applications

Medical equipment, aerospace industry, analysis equipment, precision equipment etc.


Photos

Welding/Bonding (PEEK)

High-precision welding excelling in heat resistance, chemical resistance and wear resistance is performed.

Merit of Welding/Bonding of PEEK Resin

  • Product size: Applicable for shapes bigger than material size
  • Machining shape: Applicable for various shapes which cannot be completed by machining only
  • Material cost: Applicable for shapes which possibly cerate a larger volume of material wastes when machined.

< Welding >

Method: Multiple parts are welded by using a welding rod.

  • This method is suitable for machining shapes of which welding surfaces are small
  • It is applicable to various joint shapes


< Welding/Bonding >

This method requires bonding surfaces to be melt to adhere together.

  • This style is suitable for machining shapes with larger bonding surfaces.
  • It also is suitable for products which require larger external load


Photos

Assembly

In addition to resin parts, other parts made of different material can also be assembled together.

Roughness Control

The roughness on free form surface is controlled by applying the technology established through the joint research with the research institutes of the universities.

Under the technology established through the joint-research with the research institutes of the universities, the machining requirements are selected, subject to the characteristics of resin to create required surface conditions, by quantifying the conventional craftmanship.

Our Processing Technology

Contact us